Luoyang Jinxuan Electronic Technology Co., Ltd.
Cpu Thermal Paste,Heat Sink Compound,Conductivity of Metals
Payment Type: | L/C,T/T,Money Gram |
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Incoterm: | FOB |
Model No.: Aluminum Sheet
Application: Decorations
Certification: ISO9001
Technique: Other
Grade: 1000 Series
Temper: Other
Alloy: Alloy
Transportation: Ocean
Payment Type: L/C,T/T,Money Gram
Incoterm: FOB
Aluminum nitride ceramic sheet, high thermal conductivity, low coefficient of expansion, high
strength, high temperature resistance, chemical resistance, high resistivity , low dielectric loss, is
the ideal LSI heat dissipation board and packaging materials.
ALN ceramics use heat resistant melt erosion and thermal shock resistance, can produce GaAs
crystal crucible, Al evaporation pan, MHD power generation equipment and high temperature
turbine corrosion resistant parts, using its optical properties can be used as an infrared window.
Feature:
1.High hardness , diversity
2.High precision and density
3.High reliability and stability
4.High thermal conductivity
5.Extremely abrasive resistance performance
6.Wide scope of application
Application
high-power circuits, RF and microwave circuits, GaAs crystal crucible, Al evaporation pan,
MHD power generation equipment
Other non-standard products , please contact us to provide drawings of your products.
Zirconia /alumina / aluminum oxide can be customized !
Product Categories : Aluminum Sheet > Common Aluminum Sheet